Sr Staff Advanced Package Design Engineer - 18918

**Date posted** 09/29/2026 ### **Category** **Engineering****Hire Type** **Employee****Job ID** **18918****Base Salary Range** **$144000\-$216000****Remote Eligible** **No****Date Posted** **09/29/2026** ### **We Are:** At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self\-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high\-performance silicon chips and software content. Join us to transform the future through continuous technological innovation. ### **You Are:** You are a seasoned hardware engineering professional with a passion for advanced silicon package design and a proven track record in delivering innovative solutions for complex semiconductor challenges. With more than a decade of hands\-on experience in package and interposer design, you possess a deep understanding of the latest advancements in 3DIC and multi\-physics analysis. Your expertise spans across multiple advanced packaging technologies, and you are enthusiastic about pushing the boundaries of what’s possible in high\-performance, energy\-efficient chip design. You thrive in a collaborative and fast\-paced environment, working seamlessly with multidisciplinary teams and customers to solve technical challenges creatively and efficiently. Your strong analytical skills, coupled with your ability to communicate complex technical concepts clearly, make you a trusted advisor and mentor within your team. You are comfortable working with industry\-leading EDA tools and have a solid foundation in both Windows and Linux environments. Your commitment to continuous learning and innovation drives you to stay updated with emerging trends and technologies. You approach every project with a can\-do attitude and demonstrate adaptability, resilience, and a relentless pursuit of excellence. You are excited by the opportunity to make a significant impact at Synopsys, contributing to groundbreaking products that shape the future of technology. ### **What You’ll Be Doing:** * Collaborating with cross\-functional teams during early design stages to optimize and define SIPI (Signal Integrity/Power Integrity) performance requirements, including bump mapping and power estimation. * Designing and developing advanced silicon package solutions such as silicon interposers, RDL fanout packages, and silicon bridge packages. * Modeling and analyzing advanced package designs to ensure optimal electrical, thermal, and mechanical performance. * Representing Synopsys on business unit projects as a technical leader and subject matter expert in advanced packaging. * Resolving a wide range of design and integration issues using creative, data\-driven approaches. * Supporting customer engagements in exploring and implementing advanced package solutions with Synopsys IPs. * Collaborating with global teams to